ORIENTlNG SlLICON INTEGRATED CIRCUlT CHIPS FOR LEAD BONDING
نویسنده
چکیده
Will computers that see and understand what they see revolutionize industry by automating the part orientation and part inspection processes? There are tw o obstacles: the expense of computing and our feeble understanding of images . We believe these obstacles are fast ending. To illustrate what can be done we describe a working program that visually determines the position and orientation of silicon chips used in integrated circuits. Work reported herein was conducted at the Artificial Intelligence Laboratory, a Massachusetts Institute of Technology research program supported in part by th e Advanced Research Projects Agency of the Department of Defense and monitored by the Office of Naval Research under Contract number N00014-70-A-0362-0005 ORIENTING SILICON INTEGRATED CIRCUIT CHIPS FOR LEAD BONDIN G by
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